International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 01 | Walter HUCK | PPUB | 2010-03 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2007-02-02 | ||||||
| ANW |
| 2007-08-24 | 2007-06-30 | |||||
| 1CD |
| 2008-07-04 | 2008-02-28 | |||||
| ACDV |
| 2009-02-20 | 2008-11-30 | |||||
| CCDV |
| 2009-03-06 | 2009-02-28 | |||||
| CCDV |
| 2009-05-01 | ||||||
| APUB |
| 2009-10-23 | 2009-11-15 | |||||
| DEC | 2010-01-04 | 2010-03-15 | ||||||
| BPUB | 2010-01-13 | 2010-01-31 | ||||||
| PPUB | 2010-03-16 | 2010-05-31 | ||||||
292 kBProject
IEC 61760-3 Ed. 1.0
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
Remark:
- cc: IEC TC 40,47,48,49,51