International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 04 | D.J. SOBER | PPUB | 2009-06 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-04-06 | ||||
| ANW |
| 2007-08-24 | 2007-08-31 | |||
| CCDV |
| 2007-08-25 | ||||
| ADIS |
| 2008-12-26 | 2007-12-15 | |||
| DEC | 2009-01-22 | 2009-02-28 | ||||
| RDIS | 2009-02-02 | 2009-02-15 | ||||
| CDIS |
| 2009-02-27 | 2009-04-30 | |||
| APUB |
| 2009-05-06 | 2009-04-30 | |||
| BPUB | 2009-05-07 | 2009-05-15 | ||||
| PPUB | 2009-05-26 | 2009-06-15 | ||||
184 kBProject
IEC 61249-4-15 Ed. 1.0
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Remark:
SMB/3860/DL - RDIS: 2008-10 Future IEC 61249-4-15; NP running in // with CDV
Associated Documents:
SMB/3860/DL