International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9104D.J. SOBERPPUB 2013

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/305/NP pdf file 111 kB
2002-04-26 
ANW
91/348/RVN pdf file 114 kB
2002-11-012002-09-15
1CD
91/355/CD pdf file 190 kB
2002-11-222002-12-31
ACDV
91/392/CC pdf file 189 kB
2003-05-022003-03-31
CCDV
91/420/CDV pdf file 164 kB
2003-08-292003-08-31
ADIS
91/452/RVC pdf file 122 kB
2004-05-142004-04-30
DEC
2005-04-042004-08-31
RDIS
2005-04-062005-04-30
CDIS
91/528/FDIS

2005-06-032005-07-15
APUB
91/538/RVD pdf file 171 kB
2005-08-102005-10-15
BPUB
2005-08-112005-11-15
PPUB
2005-09-222005-12-15

Project

IEC 61249-4-11 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

 

Remark:

- MRD extended per Seoul mtg, 2007-10 - Liaision IPC - targets: CCDV 2003-12, CDIS 2004-12