International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 04 | PPUB | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW | 1989-09-01 | |||||||
| ANW | 1989-11-16 | |||||||
| 1CD |
| 1994-11-11 | ||||||
| ACDV |
| 1995-06-09 | 1995-03-31 | |||||
| CCDV |
| 1996-02-02 | 1996-06-30 | |||||
| ADIS |
| 1997-02-07 | 1996-10-31 | |||||
| DEC | 1998-06-19 | 1997-07-31 | ||||||
| RDIS | 1998-07-30 | 1998-07-31 | ||||||
| CDIS |
| 1998-09-25 | 1998-10-31 | |||||
| APUB |
| 1998-12-03 | 1998-12-31 | |||||
| BPUB | 1998-12-04 | |||||||
| PPUB | 1999-02-10 | 1999-02-28 | ||||||
Project
IEC 61249-3-5 Ed. 1.0
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Remark:
- MRD extended as per decision in London mtg, 2006-10 and Seoul, 2007-10
Associated Documents:
52/744/RM