International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 04 | Ken-ichi IKEDA | PPUB | 2009-02 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-04-13 | ||||
| ANW |
| 2007-08-24 | 2007-08-31 | |||
| CCDV |
| 2007-08-25 | ||||
| ADIS |
| 2008-08-01 | 2007-12-15 | |||
| DEC | 2008-10-09 | 2008-08-15 | ||||
| RDIS | 2008-10-16 | 2008-10-31 | ||||
| CDIS |
| 2008-11-14 | 2009-01-15 | |||
| APUB |
| 2009-01-21 | 2009-01-15 | |||
| BPUB | 2009-01-22 | 2009-01-31 | ||||
| PPUB | 2009-02-11 | 2009-02-28 | ||||
245 kBProject
IEC 61249-2-34 Ed. 1.0
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
Remark:
NP running in // with CDV