International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 02 | Kaichi Tsuruta | PPUB | 2010-06 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2008-08-29 | ||||||
| 1CD |
| 2008-09-05 | 2008-09-30 | |||||
| ACDV |
| 2009-01-09 | 2009-01-31 | |||||
| CCDV |
| 2009-02-06 | 2009-01-31 | |||||
| CCDV |
| 2009-03-27 | 2009-03-15 | |||||
| ADIS |
| 2009-10-30 | 2009-10-15 | |||||
| DEC | 2010-02-08 | 2009-11-30 | ||||||
| RDIS | 2010-02-16 | 2010-02-28 | ||||||
| CDIS |
| 2010-03-12 | 2010-05-15 | |||||
| APUB |
| 2010-05-17 | 2010-05-15 | |||||
| BPUB | 2010-05-18 | 2010-05-31 | ||||||
| PPUB | 2010-06-10 | 2010-06-30 | ||||||
87 kBProject
IEC 61190-1-3 am1 Ed. 2.0
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Remark:
Project plan: CDV: 2009-07, FDIS: 2009-10.