International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9102 PPUB 2014

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2010-09-16 
PPUB
2010-11-102010-11-30

Project

IEC 61190-1-3 Ed. 2.1

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

 

Remark: