International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9102Kaichi TsurutaPPUB2007-062014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/492/MCR pdf file 91 kB
2004-09-24 
1CD
91/521/CD pdf file 298 kB
2005-04-292004-11-30
CDM
91/542/CC pdf file 126 kB
91/542A/CC pdf file 157 kB
2005-08-262005-08-31
ACDV
91/542/CC pdf file 126 kB
91/542A/CC pdf file 157 kB
2005-11-112005-11-15
CCDV
91/568/CDV pdf file 318 kB
2005-11-252005-11-30
CDVM
91/604/RVC pdf file 184 kB
91/604A/RVC pdf file 209 kB
2006-05-122006-06-30
ADIS
91/604/RVC pdf file 184 kB
91/604A/RVC pdf file 209 kB
2006-10-062006-07-31
DEC
2006-10-272006-11-30
RDIS
2006-11-062006-11-30
CDIS
91/647/FDIS
2007-02-022007-02-15
APUB
91/679/RVD pdf file 117 kB
2007-04-132007-05-15
BPUB
2007-04-162007-06-15
PPUB
2007-04-262007-07-15

Project

IEC 61190-1-3 Ed. 2.0

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

 

Remark:

- Targets: CCDV 2005-11, CDIS 2006-11 - This ed.2 PR will integrate IEC 61190-1-7/PWI