International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9103Koichi HagioPPUB2013-052016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/823/NP pdf file 226 kB
2008-10-10 
ANW
91/867/RVN pdf file 50 kB
2009-05-082009-02-28
1CD
91/879/CD pdf file 292 kB
2009-08-142009-06-30
A2CD
91/931/CC doc file 176 kB
pdf file 333 kB
2010-06-252009-12-31
2CD
91/969/CD pdf file 320 kB
2011-02-252010-07-31
ACDV
91/976/CC pdf file 230 kB
2011-06-102011-05-31
CCDV
91/1001/CDV pdf file 527 kB
pdf file 540 kB
2011-09-072011-07-31
ADIS
91/1040/RVC doc file 206 kB
pdf file 206 kB
2012-04-192012-05-15
DEC
2012-11-192012-08-31
RDIS
2012-11-282012-12-15
CDIS
91/1086/FDIS

2013-02-072013-02-28
APUB
91/1097/RVD pdf file 54 kB
2013-04-152013-04-15
BPUB
2013-04-162013-04-30
PPUB
2013-05-072013-05-31

Project

IEC 61189-11 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

 

Remark:

Function concerned - Quality assurance. Targets - CDV: 2010-06 FDIS: 2011-06