International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Hiroshi OSHIMA, Masashi AokiPPUB2011-092015

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/532/NP pdf file 523 kB
2005-06-24 
ANW
91/584/RVN pdf file 167 kB
2006-03-172005-11-15
1CD
91/682/CD pdf file 646 kB
2007-04-202006-09-30
CDM
91/725/CC pdf file 45 kB
91/725A/CC pdf file 273 kB
2007-09-212007-08-31
A2CD
91/725/CC pdf file 45 kB
91/725A/CC pdf file 273 kB
2008-12-052008-03-31
2CD
91/846/CD pdf file 528 kB
2009-01-302008-11-30
ACDV
91/875/CC pdf file 847 kB
2009-06-262009-06-30
CCDV
91/903/CDV pdf file 717 kB
pdf file 790 kB
91/903F/CDV pdf file 790 kB
2009-11-202009-09-30
ADIS
91/944/RVC doc file 291 kB
pdf file 277 kB
2010-09-102010-07-31
DEC
2011-04-142011-05-31
RDIS
2011-04-192011-04-30
CDIS
91/975/FDIS

2011-06-032011-07-15
APUB
91/992/RVD pdf file 73 kB
2011-08-152011-08-15
BPUB
2011-08-162011-08-31
PPUB
2011-09-072011-09-30

Project

IEC 60068-2-83 Ed. 1.0

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

 

Remark:

- SMB/3860/DL - 2CD: 2008-11 - cc: 23J,40,47,47D,48B,51 and 104

 

Associated Documents:

SMB/3860/DL