International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Msashi AokiADIS2015-032021

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/962/RR pdf file 39 kB
2011-02-11 
1CD
91/963/CD pdf file 586 kB
2011-02-122011-02-28
A2CD
91/980/CC pdf file 137 kB
2011-06-172011-06-30
2CD
91/1016/CD pdf file 412 kB
2011-10-282011-08-30
A3CD
91/1046/CC doc file 554 kB
pdf file 1003 kB
2012-08-242012-03-31
3CD
91/1047/CD pdf file 1203 kB
2012-08-242012-08-31
ACDV
91/1135/CC doc file 178 kB
pdf file 131 kB
2013-08-222012-12-31
CCDV
91/1136/CDV
pdf file 549 kB
pdf file 472 kB
2013-10-312013-11-30
ADIS
2014-07-112014-04-30
DEC
 2014-10-31

Project

IEC 60068-2-58 Ed. 4.0

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

 

Remark:

SMB/5155/DL - CCDV: 2013-11-30, FDIS: 2014-09-30. SMB/5155/DL - CCDV: 2013-11-30. SMB/5067/DL - CCDV: 2013-06-30. SMB/4881/DL - CCDV: 2013-03-31, FDIS: 2013-12-31 Function concerned - Quality assurance

 

Associated Documents:

SMB/4881/DL

SMB/5067/DL

SMB/5155/DL