International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | Jim LYNCH | PPUB | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 1998-02-27 | ||||||
| ANW |
| 1998-06-19 | 1998-07-15 | |||||
| 1CD |
| 1999-07-23 | 1999-11-30 | |||||
| ACDV |
| 2000-07-14 | 1999-12-31 | |||||
| CCDV |
| 2000-07-21 | 2000-07-31 | |||||
| ADIS |
| 2001-02-23 | 2001-03-31 | |||||
| DEC | 2001-11-01 | 2001-07-31 | ||||||
| RDIS | 2001-11-05 | 2001-11-30 | ||||||
| CDIS |
| 2002-01-18 | 2002-02-15 | |||||
| APUB |
| 2002-03-26 | 2002-04-30 | |||||
| BPUB | 2002-03-27 | 2002-05-31 | ||||||
| PPUB | 2002-04-12 | 2002-05-31 | ||||||
1248 kBProject
IEC 60749-4 Ed. 1.0
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Remark:
- Formerly IEC/PAS 62177 (47/1450/PAS-47/1483/RVD) - Derived from Proj. No. 60749/F2/Ed.3