International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 47 |
Semiconductor devices |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 47 | 02 | Jim Lynch | PPUB | 2010-08 | 2015 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2009-01-09 | ||||||
| CCDV |
| 2009-07-31 | 2009-06-30 | |||||
| APUB |
| 2010-06-11 | 2010-03-31 | |||||
| DEC | 2010-07-01 | 2010-07-31 | ||||||
| BPUB | 2010-07-05 | 2010-07-31 | ||||||
| PPUB | 2010-07-28 | 2010-11-30 | ||||||
9 kB
95 kBProject
IEC 60749-19 am1 Ed. 1.0
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Remark: