International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47F | 01 | Sekwang PARK/Joon-Shik PARK | PPUB | 2011-07 | 2015 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2007-03-30 | ||||||
| ANW |
| 2007-09-28 | 2007-08-15 | |||||
| 1CD |
| 2007-11-30 | 2007-12-31 | |||||
| CDM |
| 2008-04-25 | 2008-03-31 | |||||
| A2CD |
| 2008-09-12 | 2008-07-31 | |||||
| 2CD |
| 2008-11-28 | 2008-10-31 | |||||
| ACDV |
| 2009-07-10 | 2009-04-30 | |||||
| CCDV |
| 2009-09-04 | 2009-07-31 | |||||
| CCDV |
| 2009-09-18 | 2009-07-31 | |||||
| ADIS |
| 2010-08-27 | 2010-05-15 | |||||
| DEC | 2011-03-11 | 2010-11-30 | ||||||
| RDIS | 2011-03-17 | 2011-03-31 | ||||||
| CDIS |
| 2011-04-22 | 2011-06-15 | |||||
| APUB |
| 2011-06-29 | 2011-06-30 | |||||
| BPUB | 2011-06-30 | 2011-07-15 | ||||||
| PPUB | 2011-07-13 | 2011-08-15 | ||||||
272 kB
181 kBProject
IEC 62047-9 Ed. 1.0
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Remark:
- Targets: CDV: 2008-09 FDIS: 2009-09 cc: 49, 56, 91, 101 - Transferred from TC 47/WG 4