International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47F | 01 | Chiemi Ishiyama | PPUB | 2012-03 | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
| PNW |
| 2009-07-03 | ||||||||
| ANW |
| 2009-10-16 | 2009-11-30 | |||||||
| 1CD |
| 2010-02-19 | 2010-02-28 | |||||||
| A2CD |
| 2010-05-28 | 2010-06-30 | |||||||
| CDM |
| 2010-09-03 | 2010-09-30 | |||||||
| ACDV |
| 2010-12-17 | 2010-11-30 | |||||||
| CCDV |
| 2010-12-24 | 2010-12-31 | |||||||
| ADIS |
| 2011-08-05 | 2011-08-31 | |||||||
| DEC | 2011-10-04 | 2011-09-30 | ||||||||
| RDIS | 2011-10-07 | 2011-10-31 | ||||||||
| CDIS |
| 2011-12-01 | 2012-01-15 | |||||||
| APUB |
| 2012-02-06 | 2012-02-15 | |||||||
| BPUB | 2012-02-07 | 2012-02-29 | ||||||||
| PPUB | 2012-02-28 | 2012-03-31 | ||||||||
171 kB
101 kBProject
IEC 62047-13 Ed. 1.0
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
Remark:
CDV: 2010-09 FDIS: 2011-08