International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Mark BIRD | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2006-11-24 | ||||
| DEL |
| 2007-04-20 | 2007-04-15 | |||
229 kBProject
PNW 47D-674 Ed. 1.0
Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18 x 24 x 1,4 mm
Remark:
- PR to re-start with MCR - US 06-004; 1CD: 2007-03, IS: 2009-03