International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Mark BIRDDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/674/NP  
2006-11-24 
DEL
47D/684/RVN  
2007-04-202007-04-15

Project

PNW 47D-674 Ed. 1.0

Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18 x 24 x 1,4 mm

 

Remark:

- PR to re-start with MCR - US 06-004; 1CD: 2007-03, IS: 2009-03