International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | James Bird | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2003-04-11 | ||||
| DEL |
| 2003-08-15 | 2003-08-31 | |||
203 kBProject
PNW 47D-540 Ed. 1.0
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
Remark:
- US No 03127 - NP rejected - not enough experts