International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | I. Anjoh | CAN |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2001-02-23 | ||||
| ANW |
| 2001-07-06 | 2001-07-15 | |||
| 1CD |
| 2002-02-15 | 2001-12-31 | |||
| A2CD |
| 2002-07-12 | 2002-06-15 | |||
| 2CD |
| 2003-02-21 | 2002-10-31 | |||
| CDM |
| 2003-06-13 | 2003-06-30 | |||
| CAN | 2005-02-09 | 2003-11-30 | ||||
102 kBProject
IEC 60191-6-9 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages - Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP)
Remark:
- US sec no.: 2/99023 Target: CCDV 2002-05, CDIS 2003-05 - Proj cancelled acc to 47/613/RM & SMB mtg 05-02: SMB/2995/DL
Associated Documents:
SMB/2995/DL