International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D  MERGED2012-092014

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2012-07-11 
MERGED
2013-01-23 
PPUB
2013-01-232012-09-30

Project

IEC 60191-6-8 fF Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

 

Remark: