International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | MERGED | 2012-09 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| BPUB | 2012-07-11 | |||
| MERGED | 2013-01-23 | |||
| PPUB | 2013-01-23 | 2012-09-30 | ||
Project
IEC 60191-6-8 fF Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Remark: