International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02 PPUB 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D(JP)/2/NP  
1994-03-01 
ANW
47D/49/RVN  
1994-07-15 
1CD
47D/131/CD  
1996-07-261996-05-31
ACDV
1997-09-191997-09-30
CCDV
47D/239/CDV pdf file 399 kB
1998-10-021997-12-31
CDVM
47D/293/RVC pdf file 36 kB
1999-05-071999-06-30
ADIS
1999-05-121999-12-31
DEC
2000-02-012000-03-31
ADIS
2000-02-022000-12-31
DEC
2001-01-092001-01-31
ADISSB
2001-01-16 
DEC
2001-05-04 
RDIS
2001-05-042001-05-31
CDIS
47D/438/FDIS
2001-05-182001-08-15
APUB
47D/456/RVD pdf file 23 kB
2001-07-252001-08-31
BPUB
2001-07-262001-09-30
PPUB
2001-08-272001-09-30

Project

IEC 60191-6-8 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - Change of project no. - Former 60191-6/A1/f2/E1. - Change of project no. - Former 60191-6/A2/f2/E1. - US Sec. No: 2/99019

 

Associated Documents:

47D/96/RM

 
47D/162/CC

 
47D/203/RM

 
47D/318/RM

47D/409/RM