International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D  MERGED2012-092020

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2012-07-11 
MERGED
2012-12-11 
PPUB
2012-12-112012-09-30

Project

IEC 60191-6-4 fF Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

 

Remark: