International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Seiji HAMANO | PPUB | 2017 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2000-09-08 | ||||||
| ANW |
| 2001-01-12 | 2001-01-31 | |||||
| ACDV | 2001-06-06 | 2001-08-31 | ||||||
| CCDV |
| 2001-10-12 | 2001-08-31 | |||||
| CDVM |
| 2002-03-22 | 2002-06-15 | |||||
| ADIS |
| 2002-08-16 | 2002-06-30 | |||||
| DEC | 2002-11-19 | 2002-08-31 | ||||||
| RDIS | 2002-11-22 | 2002-12-15 | ||||||
| CDIS |
| 2003-02-14 | 2003-02-28 | |||||
| APUB |
| 2003-04-25 | 2003-05-31 | |||||
| BPUB | 2003-04-28 | 2003-06-30 | ||||||
| PPUB | 2003-06-11 | 2003-07-31 | ||||||
113 kBProject
IEC 60191-6-4 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Remark:
- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - intended to supersede 47D/252/NP - 47D/290/RVN - Decision taken at Arlington/USA - US Sec No: 2/95008
Associated Documents:
47D/409/RM
47D/447/RM47D/515/RM