International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47DWG2Mr. Hirofumi NakajimaPPUB2012-122022

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/782/NP pdf file 471 kB
2010-08-27 
ANW
47D/801/RVN doc file 127 kB
pdf file 217 kB
2011-04-082011-01-15
1CD
47D/802/CD pdf file 652 kB
2011-05-272011-06-30
ACDV
47D/811/CC pdf file 24 kB
47D/811A/CC doc file 90 kB
pdf file 138 kB
2011-09-142011-10-15
CCDV
47D/812/CDV pdf file 1545 kB
pdf file 1682 kB
47D/812F/CDV pdf file 1682 kB
2011-11-242011-12-31
APUB
47D/820/RVC doc file 93 kB
pdf file 119 kB
2012-05-182012-07-31
DEC
2012-10-052012-11-30
BPUB
2012-10-172012-10-31
PPUB
2012-12-112013-02-28

Project

IEC 60191-6-22 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

 

Remark:

Project plan - CDV: 2013-03 FDIS: 2013-12