International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02Mark BirdPPUB 2016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/229/NP  
1998-07-17 
ANW
47D/265/RVN  
1998-11-301998-11-30
1CD
47D/301/CD  
1999-06-111999-06-30
CDM
47D/326/CC  
1999-10-151999-10-31
CCDV
47D/372/CDV  
2000-06-231999-11-30
CDVM
47D/405/RVC  
2000-12-222001-02-28
ADIS
2001-06-062001-07-31
DEC
2001-07-172001-11-30
RDIS
2001-07-182001-08-15
CDIS
47D/460/FDIS  
2001-08-172001-10-31
APUB
47D/471/RVD  
2001-11-012001-11-30
BPUB
2001-11-022001-12-31
PPUB
2001-12-112002-01-15

Project

IEC 60191-6-2 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - Change of proj no- Former IEC 60191-6/A1/f10/E1- then 60191-6-2 - 2/95009

 

Associated Documents:

47D/447/RM