International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Mark Bird | PPUB | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1998-07-17 | ||||
| ANW |
| 1998-11-30 | 1998-11-30 | |||
| 1CD |
| 1999-06-11 | 1999-06-30 | |||
| CDM |
| 1999-10-15 | 1999-10-31 | |||
| CCDV |
| 2000-06-23 | 1999-11-30 | |||
| CDVM |
| 2000-12-22 | 2001-02-28 | |||
| ADIS | 2001-06-06 | 2001-07-31 | ||||
| DEC | 2001-07-17 | 2001-11-30 | ||||
| RDIS | 2001-07-18 | 2001-08-15 | ||||
| CDIS |
| 2001-08-17 | 2001-10-31 | |||
| APUB |
| 2001-11-01 | 2001-11-30 | |||
| BPUB | 2001-11-02 | 2001-12-31 | ||||
| PPUB | 2001-12-11 | 2002-01-15 | ||||
46 kBProject
IEC 60191-6-2 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Remark:
- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - Change of proj no- Former IEC 60191-6/A1/f10/E1- then 60191-6-2 - 2/95009
Associated Documents:
47D/447/RM