International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Jun-ichi OHNO | PPUB | 2007-06 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2004-01-30 | ||||
| ANW |
| 2004-09-03 | 2004-06-15 | |||
| CCDV |
| 2005-04-08 | 2005-06-30 | |||
| ADIS |
| 2006-08-18 | 2005-12-15 | |||
| DEC | 2007-01-05 | 2006-10-30 | ||||
| RDIS | 2007-01-05 | 2007-01-31 | ||||
| CDIS |
| 2007-02-02 | 2007-04-15 | |||
| APUB |
| 2007-04-13 | 2007-07-15 | |||
| BPUB | 2007-04-16 | 2007-08-15 | ||||
| PPUB | 2007-04-26 | 2007-09-15 | ||||
302 kBProject
IEC 60191-6-16 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Remark:
- US No 03-030 - cc: TC 48 - NEW Targets approved by SMB/3298A/INF - RDIS:2006-10, IS:2007-08
Associated Documents:
SMB/3298A/INF