International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02Masashi OSTUKADEL2007-12 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/575/NP pdf file 319 kB
2004-01-30 
ANW
47D/594/RVN pdf file 113 kB
2004-09-032004-06-15
PWI
2006-09-292005-12-31
PNW
47D/672/NP pdf file 282 kB
2006-11-03 
DEL
47D/696/RVN pdf file 107 kB
2007-06-292007-03-31

Project

IEC 60191-6-15 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages- Measuring methods for package dimensions of small outline packages (SOP)

 

Remark:

- PR put to PWI acc to decision at Berlin, 2006-09-29; Re-start with NP-CD - US No 2/03-028 - NEW targets approved SMB/3298A/INF: CCDV: 2006-10, FDIS:2007-08 IS: 2008-06 - extension of targets approved by SMB/3099/R, Cape Town 05-10-17

 

Associated Documents:

SMB/3130/DL

SMB/3298A/INF

47D/673/CD