International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D  MERGED2008-092014

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2008-07-28 
MERGED
2008-09-18 
PPUB
2008-09-182008-09-30

Project

IEC 60191-6-13 fF Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

 

Remark: