International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Jun-ichi OHNO | PPUB | 2007-09 | 2017 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2004-04-23 | ||||
| ANW |
| 2004-08-27 | 2004-09-15 | |||
| CCDV |
| 2005-04-08 | 2005-06-30 | |||
| ADIS |
| 2006-08-25 | 2005-12-15 | |||
| DEC | 2007-01-09 | 2006-10-31 | ||||
| RDIS | 2007-01-15 | 2007-01-31 | ||||
| CDIS |
| 2007-04-13 | 2007-04-15 | |||
| APUB |
| 2007-06-18 | 2007-07-15 | |||
| BPUB | 2007-06-19 | 2007-07-15 | ||||
| PPUB | 2007-06-27 | 2007-09-15 | ||||
252 kBProject
IEC 60191-6-13 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Remark:
- US No: 2/03031 - Targets FDIS: 2006-10, IS: 2007-08 approved SMB/3298A/INF
Associated Documents:
SMB/3298A/INF