International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | I. Anjoh | DELPUB | 2002-07 | 2012 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1999-12-17 | ||||
| ANW |
| 2000-04-14 | 2000-04-30 | |||
| CCDV |
| 2000-09-15 | 2001-02-15 | |||
| CDVM |
| 2001-03-02 | 2001-05-31 | |||
| ADIS | 2001-06-06 | 2001-07-31 | ||||
| DEC | 2002-01-09 | 2001-09-30 | ||||
| ADISSB | 2002-01-10 | |||||
| DEC | 2002-02-22 | 2002-02-15 | ||||
| RDIS | 2002-02-25 | 2002-03-15 | ||||
| CDIS |
| 2002-03-08 | 2002-05-31 | |||
| APUB |
| 2002-05-13 | 2002-06-30 | |||
| BPUB | 2002-05-14 | 2002-07-31 | ||||
| PPUB | 2002-06-14 | 2002-07-15 | ||||
| DELPUB | 2011-06-08 | |||||
346 kBProject
IEC 60191-6-12 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Remark:
- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - This proj derives from 60191-6-11 which has been split into IEC 60191-6-11 (FBGA) and 60191-6-12 (FLGA) - US Sec No: 2/00027 (2/99026A and 2/99026B)
Associated Documents:
47D/409/RM
47D/447/RM