International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D02I. AnjohDELPUB2002-072012

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/337/NP  
1999-12-17 
ANW
47D/369/RVN  
2000-04-142000-04-30
CCDV
47D/395/CDV  
2000-09-152001-02-15
CDVM
47D/427/RVC  
2001-03-022001-05-31
ADIS
2001-06-062001-07-31
DEC
2002-01-092001-09-30
ADISSB
2002-01-10 
DEC
2002-02-222002-02-15
RDIS
2002-02-252002-03-15
CDIS
47D/493/FDIS  
2002-03-082002-05-31
APUB
47D/507/RVD  
2002-05-132002-06-30
BPUB
2002-05-142002-07-31
PPUB
2002-06-142002-07-15
DELPUB
2011-06-08 

Project

IEC 60191-6-12 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - This proj derives from 60191-6-11 which has been split into IEC 60191-6-11 (FBGA) and 60191-6-12 (FLGA) - US Sec No: 2/00027 (2/99026A and 2/99026B)

 

Associated Documents:

47D/409/RM

 
47D/447/RM