International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02I. AnjohDELPUB2002-072012

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/337/NP pdf file 346 kB
1999-12-17 
ANW
47D/369/RVN pdf file 22 kB
2000-04-142000-04-30
CCDV
47D/395/CDV pdf file 86 kB
2000-09-152001-02-15
CDVM
47D/427/RVC pdf file 33 kB
2001-03-022001-05-31
ADIS
2001-06-062001-07-31
DEC
2002-01-092001-09-30
ADISSB
2002-01-10 
DEC
2002-02-222002-02-15
RDIS
2002-02-252002-03-15
CDIS
47D/493/FDIS
2002-03-082002-05-31
APUB
47D/507/RVD pdf file 161 kB
2002-05-132002-06-30
BPUB
2002-05-142002-07-31
PPUB
2002-06-142002-07-15
DELPUB
2011-06-08 

Project

IEC 60191-6-12 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - This proj derives from 60191-6-11 which has been split into IEC 60191-6-11 (FBGA) and 60191-6-12 (FLGA) - US Sec No: 2/00027 (2/99026A and 2/99026B)

 

Associated Documents:

47D/409/RM

47D/447/RM