International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D02I. AnjohDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/337/NP pdf file 346 kB
1999-12-17 
ANW
47D/369/RVN pdf file 22 kB
2000-04-142000-04-30
1CD
47D/394/CD pdf file 84 kB
2000-09-152000-06-30
ACDV
47D/412/CC pdf file 18 kB
2000-10-042001-01-31
CCDV
47D/482/CDV pdf file 151 kB
2002-01-112001-11-30
CDVM
47D/511/RVC pdf file 129 kB
2002-07-122002-09-15
ACDV
2002-11-012002-12-15
PWI
2004-06-172003-07-31
DEL
2005-04-252002-11-30

Project

IEC 60191-6-11 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA)

 

Remark:

- PR considered with 60191-6, Relationship EIAJ, EDR-7323 - Thenproject split in two: decision Arlington - into 60191-6-11(FBGA) and 60191-6-12(FLGA) - US No: 2/99026A + 99026B) - SMB/2867/DL 04-06-17 - PR put at PWI - Then decision to DEL it 2005-04 - PR deleted as approved at Munich meeting 2005-04-25/26

 

Associated Documents:

47D/409/RM

47D/447/RM

SMB/2867/DL

47D/624/RM