International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | I. Anjoh | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1999-12-17 | ||||
| ANW |
| 2000-04-14 | 2000-04-30 | |||
| 1CD |
| 2000-09-15 | 2000-06-30 | |||
| ACDV |
| 2000-10-04 | 2001-01-31 | |||
| CCDV |
| 2002-01-11 | 2001-11-30 | |||
| CDVM |
| 2002-07-12 | 2002-09-15 | |||
| ACDV | 2002-11-01 | 2002-12-15 | ||||
| PWI | 2004-06-17 | 2003-07-31 | ||||
| DEL | 2005-04-25 | 2002-11-30 | ||||
346 kBProject
IEC 60191-6-11 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA)
Remark:
- PR considered with 60191-6, Relationship EIAJ, EDR-7323 - Thenproject split in two: decision Arlington - into 60191-6-11(FBGA) and 60191-6-12(FLGA) - US No: 2/99026A + 99026B) - SMB/2867/DL 04-06-17 - PR put at PWI - Then decision to DEL it 2005-04 - PR deleted as approved at Munich meeting 2005-04-25/26
Associated Documents:
47D/409/RM
47D/447/RMSMB/2867/DL47D/624/RM