International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | I. Anjoh | PPUB | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1999-12-10 | ||||
| ANW |
| 2000-04-14 | 2000-04-30 | |||
| ACDV | 2000-05-12 | 2000-06-30 | ||||
| CCDV |
| 2001-02-23 | 2000-09-30 | |||
| CDVM |
| 2001-08-17 | 2001-10-31 | |||
| ADIS | 2001-10-15 | 2001-11-30 | ||||
| DEC | 2003-03-05 | 2002-11-30 | ||||
| RDIS | 2003-03-07 | 2003-03-31 | ||||
| CDIS |
| 2003-06-13 | 2003-06-15 | |||
| APUB |
| 2003-08-21 | 2003-09-15 | |||
| BPUB | 2003-08-22 | 2003-10-15 | ||||
| PPUB | 2003-11-19 | 2003-11-15 | ||||
44 kBProject
IEC 60191-6-10 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Remark:
- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - US Sec. No: 2/99025
Associated Documents:
47D/381/RM
47D/476/RM