International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02M. SonoPPUB 2021

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/190/NP  
1997-07-11 
ANW
47D/245/RVN  
1998-10-091997-11-30
1CD
47D/255/CDV  
1998-11-191998-11-30
CCDV
47D/255/CDV  
1998-11-20 
NADIS
47D/297/RVC pdf file 46 kB
1999-05-111999-07-31
ACDV
1999-05-121999-06-30
CCDV
47D/339/CDV pdf file 33 kB
1999-12-171999-12-31
CDVM
47D/379/RVC pdf file 75 kB
2000-06-302000-08-31
ADIS
2000-10-042000-11-30
DEC
2001-05-222001-03-31
RDIS
2001-05-282001-06-15
CDIS
47D/459/FDIS
2001-08-032001-08-15
APUB
47D/470/RVD pdf file 26 kB
2001-10-082001-11-15
BPUB
2001-10-092001-12-15
PPUB
2001-10-302001-12-15

Project

IEC 60191-6-1 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - Change of project no. - Former 60191-6/A1/F9/E1. - US Sec. No: 2/95005

 

Associated Documents:

47D/409/RM