International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | MERGED |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1991-11-15 | |||||
| ANW |
| 1992-03-15 | ||||
| 1CD |
| 1993-10-01 | ||||
| ACDV | 1995-11-10 | 1994-02-01 | ||||
| CCDV |
| 1997-04-04 | 1997-01-31 | |||
| ADIS |
| 1998-01-23 | 1997-12-31 | |||
| DEC | 1999-01-25 | 1998-05-31 | ||||
| MERGED | 1999-02-09 | |||||
Project
IEC 60191-6 am1 f5 Ed. 1.0
IEC 191-6 - General rules for TSOP (Thin small outline package) Type II
Remark:
Associated Documents:
47D/96/RM