International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01 MERGED  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
   
1991-11-15 
ANW
47(SEC.)/1270/RVN  
1992-03-15 
1CD
47D(SEC.)/11/CD  
1993-10-01 
ACDV
1995-11-101994-02-01
CCDV
47D/170/CDV  
1997-04-041997-01-31
ADIS
47D/207/RVC  
1998-01-231997-12-31
DEC
1999-01-251998-05-31
MERGED
1999-02-09 

Project

IEC 60191-6 am1 f5 Ed. 1.0

IEC 191-6 - General rules for TSOP (Thin small outline package) Type II

 

Remark:

 

Associated Documents:

47D/96/RM

 
47D/149/RM

 
47D/203/RM