International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | MERGED | 2015 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1994-08-12 | ||||
| ANW |
| 1995-03-31 | 1995-01-01 | |||
| MERGED | 1995-08-11 | |||||
Project
IEC 60191-3 f2 Ed. 2.0
Definition of mold flash, interlead flash, gate burrs and protrusions for plastic packages, to be introduced into IEC 191-2
Remark: