International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Michael AhrMERGED2013-042014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/789/RR pdf file 19 kB
2010-11-18 
1CD
47D/791/CD pdf file 253 kB
2010-11-192010-12-31
ACDV
47D/800/CC doc file 102 kB
pdf file 236 kB
2011-04-082011-03-31
CCDV
47D/819/CDV pdf file 330 kB
pdf file 555 kB
47D/819F/CDV pdf file 555 kB
2011-11-302011-06-30
APUB
47D/824/RVC doc file 85 kB
pdf file 113 kB
2012-05-182012-07-31
MERGED
2012-07-23 
DEC
 2012-11-30

Project

IEC 60191-2 f69 Ed. 1.0

Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.

 

Remark:

- Previous project was IEC 60191-2/F69, will become outline 187E. - F66, F67, F68 & F69 will be merged and published as Amendment 19 Project plan - CDV: 2012-12 FDIS: 2013-12 IS: 2014-06