International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Michael Ahr | MERGED | 2013-04 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2010-11-18 | ||||||
| 1CD |
| 2010-11-19 | 2010-12-31 | |||||
| ACDV |
| 2011-04-08 | 2011-03-31 | |||||
| CCDV |
| 2011-11-30 | 2011-06-30 | |||||
| APUB |
| 2012-05-18 | 2012-07-31 | |||||
| MERGED | 2012-07-23 | |||||||
| DEC | 2012-11-30 | |||||||
19 kB
99 kBProject
IEC 60191-2 f68 Ed. 1.0
Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.
Remark:
- Previous project was IEC 60191-2/F68, will become outline 186F. - F66, F67, F68 & F69 will be merged and published as Amendment 19 Project plan - CDV: 2012-12 FDIS: 2013-12 IS: 2014-06