International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01Michael AhrMERGED2013-042020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/786/RR  
2010-11-18 
1CD
47D/788/CD  
2010-11-192010-12-31
ACDV
47D/798/CC  
2011-04-082011-03-31
CCDV
47D/817/CDV  
47D/817A/CDV  
2011-11-292011-06-30
APUB
47D/822/RVC  
2012-05-182012-07-31
MERGED
2012-07-23 
DEC
 2012-11-30

Project

IEC 60191-2 f67 Ed. 1.0

Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.

 

Remark:

- Previous project was IEC 60191-2/F67, will become outline 185B. - F66, F67, F68 & F69 will be merged and published as Amendment 19 Project plan - CDV: 2011-12 FDIS: 2012-12 IS: 2013-06