International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01Michael AHRMERGED2008-052014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/630/MCR pdf file 125 kB
2005-07-15 
1CD
47D/631/CD pdf file 337 kB
2005-07-15 
ACDV
47D/641/CC pdf file 125 kB
2006-02-172005-11-30
CCDV
47D/655/CDV pdf file 350 kB
2006-05-122006-06-30
ADIS
47D/698/RVC pdf file 179 kB
47D/698A/RVC pdf file 180 kB
2007-08-102007-01-15
DEC
2008-01-032007-11-15
RDIS
2008-01-292008-01-31
CDIS
47D/712/FDIS
2008-02-222008-04-15
APUB
47D/715/RVD pdf file 98 kB
2008-04-282008-04-30
BPUB
2008-04-292008-05-15
PPUB
 2008-06-15
MERGED
  

Project

IEC 60191-2 f62 Ed. 1.0

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

 

Remark:

- Prev PROJ was IEC 60191-2/F62, will become outline 180E - F62 & F63 will be merged and published as Amendment 17 - Ext of targets - FDIS: 2007-05 -> 2007-11