International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01J. van de WaterDEL 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/523/NP pdf file 1259 kB
2002-11-22 
ANW
47D/554/RVN pdf file 121 kB
47D/554A/RVN pdf file 122 kB
2003-06-272003-04-15
ANW
47D/554/RVN pdf file 121 kB
47D/554A/RVN pdf file 122 kB
2003-07-04 
DEL
2005-04-252004-11-30

Project

IEC 60191-2 f58 Ed. 1.0

Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads)

 

Remark:

- US number: 02124 - PR deleted as approved at Munich meeting 2005-04-25/26