International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01J. Mark BIRDMERGED 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/353/NP  
2000-03-17 
ANW
47D/382/RVN  
2000-07-142000-07-31
CCDV
47D/407/CDV  
47D/407A/CDV  
2000-12-222001-01-31
CDVM
47D/442/RVC  
2001-07-062001-08-31
ADIS
2001-10-152001-11-30
DEC
2001-12-192002-03-31
RDIS
2001-12-202002-01-15
CDIS
47D/486/FDIS  
2002-02-012002-03-31
APUB
47D/500/RVD  
2002-04-102002-04-15
BPUB
2002-04-112002-05-15
MERGED
2002-04-15 
PPUB
 2002-06-15

Project

IEC 60191-2 f50 Ed. 1.0

Plastic enhanced, low profile quad flat pack (HLQFP) outline family, heat slug down, L-PQFP-G (Outline 151E-a)

 

Remark:

- 47D ref: 99115 - f/50 merged to 60191-2 A.7 former f/49

 

Associated Documents:

47D/409/RM

 
47D/476/RM