International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | T. Allen | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1999-08-06 | ||||
| ANW |
| 1999-12-17 | 1999-12-31 | |||
| MERGED | 2000-11-20 | |||||
320 kBProject
IEC 60191-2 f44 Ed. 1.0
New package outline - Thin fine pitch ball grid array family (rectangular/square)
Remark:
- JEDEC MO-210 Issue C. - US Sec. No: 99118 - This doc. has been merged into 47D/316A/CD Proj.60191-2/F5/Ed2
Associated Documents:
47D/409/RM