International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01T. AllenMERGED 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/317/NP pdf file 320 kB
1999-08-06 
ANW
47D/340/RVN pdf file 18 kB
1999-12-171999-12-31
MERGED
2000-11-20 

Project

IEC 60191-2 f44 Ed. 1.0

New package outline - Thin fine pitch ball grid array family (rectangular/square)

 

Remark:

- JEDEC MO-210 Issue C. - US Sec. No: 99118 - This doc. has been merged into 47D/316A/CD Proj.60191-2/F5/Ed2

 

Associated Documents:

47D/409/RM