International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Miwa Momma | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1998-02-06 | ||||
| ANW |
| 1998-06-30 | 1998-06-30 | |||
| PWI | 2000-03-21 | 1999-06-30 | ||||
| DEL | 2000-05-12 | |||||
Project
IEC 60191-2 f4 Ed. 2.0
32 and 48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch (Intended for inclusion into IEC 191-2)
Remark:
- N.C. are requested to withdraw the doc. 47D/304/CD
Associated Documents:
47D/381/RM
67 kB