International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Miwa MommaDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/211/NP  
1998-02-06 
ANW
47D/248/RVN  
1998-06-301998-06-30
PWI
2000-03-211999-06-30
DEL
2000-05-12 

Project

IEC 60191-2 f4 Ed. 2.0

32 and 48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch (Intended for inclusion into IEC 191-2)

 

Remark:

- N.C. are requested to withdraw the doc. 47D/304/CD

 

Associated Documents:

47D/381/RM