International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D  MERGED 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D(US)/6/NP  
1994-08-19 
ANW
47D/70/RVN  
1995-01-031995-01-01
ACDV
1995-11-10 
1CD
47D/145/CDV  
1996-10-031996-05-31
CCDV
47D/145/CDV  
1996-10-041996-03-15
CDVM
47D/164/RVC  
1997-03-281997-06-30
ADIS
1997-09-191997-09-30
RDIS
1999-02-021998-03-31
CDIS
47D/269/FDIS
1999-02-051999-05-31
APUB
47D/289/RVD pdf file 27 kB
1999-04-191999-05-31
BPUB
1999-04-20 
MERGED
1999-05-27 

Project

IEC 60191-2 f4 Ed. 1.0

Tape ball grid array (TBGA) family (Intended for inclusion into 60191-2)

 

Remark:

 

Associated Documents:

47D/149/RM

 
47D/203/RM