International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1994-08-19 | ||||
| ANW |
| 1995-01-03 | 1995-01-01 | |||
| ACDV | 1995-11-10 | |||||
| 1CD |
| 1996-10-03 | 1996-05-31 | |||
| CCDV |
| 1996-10-04 | 1996-03-15 | |||
| CDVM |
| 1997-03-28 | 1997-06-30 | |||
| ADIS | 1997-09-19 | 1997-09-30 | ||||
| RDIS | 1999-02-02 | 1998-03-31 | ||||
| CDIS |
| 1999-02-05 | 1999-05-31 | |||
| APUB |
| 1999-04-19 | 1999-05-31 | |||
| BPUB | 1999-04-20 | |||||
| MERGED | 1999-05-27 | |||||
27 kBProject
IEC 60191-2 f4 Ed. 1.0
Tape ball grid array (TBGA) family (Intended for inclusion into 60191-2)
Remark:
Associated Documents:
47D/149/RM