International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Miwa MommaDEL 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/214/NP  
1998-02-06 
ANW
47D/276/RVN pdf file 901 kB
1998-06-301998-06-30
DEL
2000-03-211999-09-30

Project

IEC 60191-2 f39 Ed. 1.0

Proposal for 0,8 mm pitch P-FBGA (plastic fine pitch ball grid array)

 

Remark:

- N:C. are requested to withdraw the Doc. 47D/302/CD