International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | H. Nakajima | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 1996-07-26 | ||||||
| DEL |
| 1996-12-09 | 1996-12-10 | |||||
| ANW |
| 1996-12-10 | ||||||
| 1CD |
| 1997-09-19 | 1997-09-30 | |||||
| ACDV |
| 1999-01-15 | ||||||
| CCDV |
| 1999-07-16 | 1999-05-15 | |||||
| ADIS |
| 2000-02-11 | 2000-03-31 | |||||
| DEC | 2000-06-19 | 2000-07-31 | ||||||
| RDIS | 2000-10-20 | 2000-10-15 | ||||||
| CDIS |
| 2000-10-27 | 2000-10-31 | |||||
| APUB |
| 2001-01-16 | 2001-01-31 | |||||
| BPUB | 2001-01-17 | 2001-02-28 | ||||||
| MERGED | 2001-02-07 | |||||||
84 kBProject
IEC 60191-2 f33 Ed. 1.0
Ceramic thin LGA, 1,0 mm pitch outline family
Remark: