International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01H. NakajimaMERGED 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/127/NP  
1996-07-26 
ANW
47D/174/RVN  
1996-12-101996-12-10
ACDV
1997-09-19 
1CD
47D/256/CDV  
1998-12-031997-12-31
CCDV
47D/256/CDV  
1998-12-041997-12-31
CDVM
47D/300/RVC pdf file 38 kB
1999-06-111999-09-30
MERGED
1999-10-20 

Project

IEC 60191-2 f31 Ed. 1.0

Proposal for a tape ball grid array, 0.75 mm ball diameter family (intended for inclusion into IEC 60191-2) as outline 146E

 

Remark:

 

Associated Documents:

47D/203/RM

 
47D/346/RM