International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | DEL | 2013 |
History
Project
IEC 60191-2 f3 Ed. 1.0
General rules for HSOP (Heat sink small outline package) - Supplement to IEC 191-2
Remark:
- Transferred from TC 47
Associated Documents:
47D/96/RM