International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01 DEL 2014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
   
1991-11-01 
ANW
1992-03-15 
DEL
1995-12-31 

Project

IEC 60191-2 f3 Ed. 1.0

General rules for HSOP (Heat sink small outline package) - Supplement to IEC 191-2

 

Remark:

- Transferred from TC 47

 

Associated Documents:

47D/96/RM