International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | DEL | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1995-09-22 | ||||
| ANW |
| 1996-02-06 | 1996-02-06 | |||
| DEL | 1996-09-20 | 1998-02-05 | ||||
Project
IEC 60191-2 f29 Ed. 1.0
Plastic thin small outline package J-Lead (P-TSOJ), 7,62 mm body family - (Supplement to IEC 191-2)
Remark:
Associated Documents:
47D/149/RM