International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | MERGED | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1995-09-08 | ||||
| ANW |
| 1996-01-23 | 1996-01-23 | |||
| ACDV | 1996-09-20 | |||||
| 1CD |
| 1997-06-26 | 1997-07-31 | |||
| CCDV |
| 1997-06-27 | 1997-07-31 | |||
| ADIS |
| 1999-01-15 | 1998-02-28 | |||
| RDIS | 1999-03-12 | 1999-06-30 | ||||
| CDIS |
| 1999-03-19 | 1999-09-30 | |||
| APUB |
| 1999-07-07 | 1999-06-30 | |||
| BPUB | 1999-07-08 | 1999-07-31 | ||||
| MERGED | 1999-08-17 | |||||
18 kBProject
IEC 60191-2 f28 Ed. 1.0
HSOP reverse bend, heatslug up
Remark:
Associated Documents:
47D/149/RM