International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 01 | Miwa Momma | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 1998-02-06 | ||||||
| ANW |
| 1998-06-30 | 1998-06-30 | |||||
| 1CD |
| 1999-07-23 | 1999-06-30 | |||||
| CDM |
| 2000-01-21 | 1999-12-31 | |||||
| DEL | 2000-05-12 | 2000-06-30 | ||||||
1351 kBProject
IEC 60191-2 f2 Ed. 2.0
Tape ball grid array package, 0,6 mm ball diameter family (intended for inclusion into IEC 60191-2)
Remark:
- Included in 47D/144/CD
Associated Documents:
47D/381/RM