International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D01Miwa MommaDEL  

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/209/NP  
1998-02-06 
ANW
47D/246/RVN  
1998-06-301998-06-30
1CD
47D/314/CD  
47D/314A/CD pdf file 1351 kB
1999-07-231999-06-30
CDM
47D/343/CC pdf file 60 kB
2000-01-211999-12-31
DEL
2000-05-122000-06-30

Project

IEC 60191-2 f2 Ed. 2.0

Tape ball grid array package, 0,6 mm ball diameter family (intended for inclusion into IEC 60191-2)

 

Remark:

- Included in 47D/144/CD

 

Associated Documents:

47D/381/RM